±â¾÷Á¤º¸
| ±â¾÷¼Ò°³ |
|
´ç»ç´Â ±¹³» ÃÖÃÊ·Î ÀüÀÚ, ¹ÝµµÃ¼¿ë, ÀÚµ¿Â÷ ÀüÀå¿ë ¼Ö´õ ÆäÀ̽ºÆ® ¹× Ç÷°½º¸¦ °³¹ßÇÏ¿© ±¹³»,¿Ü ÀüÀÚ, ¹ÝµµÃ¼ ¹× ÀÚµ¿Â÷ ÀüÀå ¾÷ü¿¡ °ø±ÞÀ» Çϰí ÀÖÀ¸¸ç, ¶ÇÇÑ ISO 9001, 14000, IAFT 16949 ½Ã½ºÅÛ ÀÎÁõÀ¸·Î Áö¼ÓÀûÀÎ ¿¬±¸, °³¹ßÀ» ÅëÇÑ Á¦Ç° Çõ½ÅÀ» ÁÖµµÇϰí ÀÖÀ¸¸ç, ÃÖ±Ù Àü¼¼°èÀûÀ¸·Î À̽´ÈµÇ´Â ģȯ°æ ¹× ÀÎü ¹«ÇØÇÑ Á¦Ç° °³¹ß¿¡ ³ë·ÂÀ» Çϸç Recycle solder paste ¶ÇÇÑ °³¹ßÇÏ¿© »óǰÈÇϴµ¥ ¼º°øÇÏ¿© ¹ÝµµÃ¼ °í°´»ç¿¡ °ø±ÞÀ» Çϰí ÀÖÀ½ |
|
| »ç¾÷ÀÚ¹øÈ£ |
139-81-38292 |
´ëÇ¥ÀÚ |
ÀüÁÖ¼± |
|
| ¼³¸³ÀÏ |
1998.11.29 |
ÀüȹøÈ£ |
01054451542 |
|
| º»»çÁÖ¼Ò |
|
(18541)
|
°æ±â ȼº½Ã ¸¶µµ¸é ¸¶µµ·Î660¹ø±æ 29 (½Ö¼Û¸®)°æ±âµµ ȼº½Ã ¸¶µµ¸é ¸¶µµ·Î660¹ø±æ 29
|
|
|
| ¸ÅÃâ¾× |
2,000(¹é¸¸¿ø) |
ÇØ¿ÜÁö»ç¼ÒÀç±¹°¡ |
´ëÇÑ |
|
ÁÖ°Å·¡Ã³ |
Amkor, ChipPAC, nexperia, TI |
|
| ´ã´çÀÚ/Á÷À§ |
Á¤¼÷ÀÚ / °úÀå
|
|
|
| ¿¬±¸³»¿ë/º¸À¯±â¼úÁ¦Ç° |
| Solder Paste, ¹ÝµµÃ¼¿ë Ç÷°½º, ÀÚµ¿Â÷ÀüÀå Á¶¸³¿ë ¼Ö´õ ÆäÀ̽ºÆ®, ÀüÀÚÆÄ Â÷Æó ±â¼ú, ÈÞ´ëÀüÈ¿ë µð½ºÇ÷¹ÀÌ ±×¶ó½º Á¦Á¶ ±â¼ú |